Heatsink

ABSTRACT

A heatsink that is sized and shaped to permit positioning multiple adjustable luminaires in close proximity to one another without the heatsinks on the adjustable luminaires contacting one another or otherwise impeding luminaire adjustment. The size and shape of the heatsink of the adjustable luminaire can be determined based on the center-to-center distance desired between the adjustable luminaires and the angle of tilt desired for the adjustable luminaires.

FIELD OF THE INVENTION

Embodiments of the present invention relate to heatsinks.

BACKGROUND OF THE INVENTION

Thermal management is of paramount importance in luminaire design. Thelight sources used in luminaires heat up during use, which candetrimentally impact the efficiency and life expectancy of such lightsources. Heatsinks have been incorporated in luminaires to facilitateheat dissipation from the light sources. Such heat dissipation canresult both from conduction of heat from the light sources via theheatsink as well as transfer of heat to the air circulating through andaround the light sources and heatsink. Such air consequently heats upand rises, thereby carrying heat away from the luminaire via convection.

Luminaires are used in a variety of settings, including outdoor andindoor spaces. To accommodate differences in the arrangement ofdifferent sites, luminaires may be configurable or adjustable at thetime of mounting so that light from the luminaire may be directed towhere it is desired.

SUMMARY OF THE INVENTION

The terms “invention,” “the invention,” “this invention” and “thepresent invention” used in this patent are intended to refer broadly toall of the subject matter of this patent and the patent claims below.Statements containing these terms should not be understood to limit thesubject matter described herein or to limit the meaning or scope of thepatent claims below. Embodiments of the invention covered by this patentare defined by the claims below, not this summary. This summary is ahigh-level overview of various aspects of the invention and introducessome of the concepts that are further described in the DetailedDescription section below. This summary is not intended to identify keyor essential features of the claimed subject matter, nor is it intendedto be used in isolation to determine the scope of the claimed subjectmatter. The subject matter should be understood by reference to theentire specification of this patent, all drawings and each claim.

Embodiments of the present invention are directed to luminaires,specifically luminaires that can be adjusted to control the direction oflight. An adjustable luminaire may be adjusted by tilting and/orrotating of the luminaire. The adjustable luminaire can include aheatsink that is sized and shaped to permit positioning multipleadjustable luminaires in close proximity to one another without theheatsinks of the adjustable luminaires contacting one another orotherwise impeding luminaire adjustment. The size and shape of theheatsink of the adjustable luminaire can be determined based at least inpart on the center-to-center distance desired between the heatsinks andthe maximum angle of tilt desired for the adjustable luminaires about aselected pivot point.

In some aspects of the invention, the luminaire may be a non-adjustableluminaire. The luminaire may include a heatsink that comprises pin finsextending from a base plate of the heatsink. The pin fins can be bentoutwardly towards an outer edge of the base plate of the heatsink suchthat the tips of the pin fins may extend beyond the base plate of theheatsink. The distance the outer pin fins extend beyond the outer edgeof the base plate can correspond to a maximum diameter of the heatsink.The maximum diameter of the heatsink can be greater than the diameter ofthe base plate of the heatsink.

BRIEF DESCRIPTION OF THE FIGURES

Illustrative embodiments of the present invention are described indetail below with reference to the following drawing figures:

FIG. 1A is a schematic depiction of two heatsinks positioned at acenter-to-center distance C, according to embodiments of the presentdisclosure.

FIG. 1B is a model cylinder depicting the center-to-center distancebetween two heatsinks, according to embodiments of the presentdisclosure.

FIG. 1C is a schematic depiction of the model cylinder positioned at aninitial angle and the model cylinder positioned at a maximum tilt angle,according to embodiments of present disclosure.

FIG. 1D is a schematic depiction of the geometric boundaries of oneembodiment of a heatsink.

FIG. 2 is a top perspective view of a heatsink that falls within thegeometric dimensions depicted in FIG. 1D, according to embodiments ofthe present disclosure.

FIG. 3 is a top perspective view of a heatsink that falls within thegeometric dimensions depicted in FIG. 1D, according to embodiments ofthe present disclosure.

FIG. 4 is a top perspective view of a heatsink that falls within thegeometric dimensions depicted in FIG. 1D, according to embodiments ofthe present disclosure.

FIG. 5 is a top perspective view of a heatsink that falls within thegeometric dimensions depicted in FIG. 1D, according to embodiments ofthe present disclosure.

FIG. 6 is a perspective view of two luminaires having heatsinksaccording to embodiments of the present disclosure.

FIG. 7 is a side view of three luminaires having heatsinks according toembodiments of the present disclosure.

FIG. 8 depicts a method of determining the geometric dimensions of aheatsink, according to embodiments of the present disclosure.

FIG. 9 is a block diagram depicting an example of a computing device forperforming the method of FIG. 8.

FIG. 10 is a side view of a heatsink, according to embodiments of thepresent disclosure.

FIG. 11 is a top view of the heatsink of FIG. 10, according toembodiments of the present disclosure.

FIG. 12 is a perspective view of the heatsink of FIG. 10, according toembodiments of the present disclosure.

DETAILED DESCRIPTION

The subject matter of embodiments of the present invention is describedhere with specificity to meet statutory requirements, but thisdescription is not necessarily intended to limit the scope of theclaims. The claimed subject matter may be embodied in other ways, mayinclude different elements or steps, and may be used in conjunction withother existing or future technologies. This description should not beinterpreted as implying any particular order or arrangement among orbetween various steps or elements except when the order of individualsteps or arrangement of elements is explicitly described.

Certain embodiments of the present invention provide a heatsink that issized and shaped to permit positioning adjustable luminaires in closeproximity to one another without the heatsinks interfering with oneanother during adjustment of the luminaires. The heatsinks of theadjustable luminaires can be sized and shaped to permit clearance of oneanother during tilting and rotation of the adjustable luminaires. Insome embodiments, the size and shape of the heatsink can be determinedbased on the center-to-center distance between the heatsinks and themaximum desired angle of tilt of the luminaires. The heatsink cancomprise continuous fins, pin fins, or a solid material and may bemanufactured using cold forging, impact forging, extrusion, casting,machining, sintering, or other suitable manufacturing methods. Theheatsink can comprise aluminum, copper, or other suitable materials forconducting heat.

In some embodiments, the heatsinks are formed using an impact forgingprocess. Impact forging is a cold process that starts with a metallicform (e.g., a metal billet) and effectively shapes the form as desiredusing an impactive force. This is in contrast to die casting wherebymolten metal is forced under high pressure into a mold cavity to createthe desired shape. With impact forging, the fins may be positionedcloser together than with the die casting process so that more fins maybe provided on a given heatsink footprint. The fins may be positionedcloser together with impact forging at least because impact forging doesnot require a draft, while die casting requires a draft, which thickensthe features of the fin. Additional fins result in more surface area forheat transfer and consequently a heatsink with better thermal managementproperties. Impact forging also permits the use of 6000 series aluminum(e.g., aluminum 6061:http://asm.matweb.com/search/SpecificMaterial.asp?bassnum=MA6061t6)which is more thermally conductive than other types of aluminum. Suchaluminum is not suitable in the traditional die-casting process; forexample, aluminum 6061 may be more suited to applications that requireheat treatment while aluminum 383, and other traditional casting alloys,are formulated for flowing in molds used for casting.

In certain embodiments, the heatsinks of the adjacent luminaires may beshaped to permit the heatsinks to clear each other during tilting androtation of the luminaires. In some aspects, the heatsinks of theluminaires can tilt between about 0 degrees and about 60 degrees(measured from an original position, which can be—but does not have tobe—the position of the heat sink prior to any tilting of the luminaire)about a pivot point, and may be rotatable up to 365 degrees. As shown inFIGS. 1A-1D, the size and shape parameters of the heatsinks can bedictated in part based on the desired center-to-center spacing C (shownin FIG. 1A) between two adjacent heatsinks 100, 102. In some aspects,more than two heatsinks may be used.

As shown in FIG. 1B, a 3-dimensional model cylinder 104 may have adiameter C, which is equal to the desired center-to-center spacingbetween the heatsinks 100, 102. The model cylinder 104 may also have aheight H. The height H may be essentially infinite in height. FIG. 1Cdepicts the model cylinder 104 positioned in an original position of theheatsinks 100, 102 during installation, shown in FIG. 1C as a verticalposition. In some embodiments, the heatsinks 100, 102 may be in adifferent original position, for example at a tilt angle of 10 degrees,or any other suitable position. The diameter C and the height H of themodel cylinder 104 represent the geometrical constraints on eachheatsink 100, 102 at the original position.

A 3-dimensional tilted model cylinder 104′ may be mapped over the3-dimensional model cylinder 104 by positioning the tilted modelcylinder 104′ at a maximum tilt angle T relative to the originalposition. The maximum tilt angle T can represent the maximumcontemplated angle at which the heatsinks 100, 102 may be tilted in aninstallation. The tilted model cylinder 104′ can be tilted at a pivotpoint 110, which may be selected based on the installation. The heightof the tilted model cylinder 104′ and the model cylinder 104 may beessentially infinite and may be determined based on manufacturingcapabilities and other desired characteristics of the installation, forexample but not limited to the geometric constraints of the heatsinks100, 102. As shown in FIG. 1C, the tilted model cylinder 104′ istherefore positioned at the maximum tilt angle T about the pivot point110. The tilted model cylinder 104′ can represent the geometricalconstraints on the size of the heatsinks 100, 102 when they are tiltedup to the maximum tilt angle T from their original position (shown inFIG. 1C as vertical).

As shown in FIG. 1C, the shape and size of the heatsinks 100, 102 havinga center-to-center distance C (shown in FIG. 1A) and a maximum tiltangle T about a pivot point 110 can be defined by the overlappingregions of the model cylinder 104 and the tilted model cylinder 104′(shown as region 112). Any portion of the model cylinder 104 that doesnot overlap with the tilted model cylinder 104′ (e.g., region 114) is aportion of the heatsinks 100, 102 that would fall outside the geometricbounds of the heatsinks 100, 102. Similarly, any portion of the tiltedmodel cylinder 104′ that does not overlap with the model cylinder 104(e.g., regions 116, 118) also falls outside of the geometric bounds ofthe heatsinks 100, 102.

As shown in FIGS. 1C and 1D, the portions of the model cylinder 104 andthe tilted model cylinder 104′ that overlap one another, shown as region112, can define the geometric bounds of the heatsinks 100, 102 thatpermit the heatsinks to be placed at a center-to-center distance C(shown in FIG. 1A) and up to a maximum tilt angle T about a pivot point110 without the heatsinks 100, 102 interfering with one another duringrotation and tilting. Region 112 can include an upper portion 120 whichmay be narrower than a lower portion 122. The heatsinks 100, 102 may beof any shape or size that falls within the geometric bounds of region112. The final dimensions (size, shape, etc.) of the heatsinks 100, 102that fall within the dimensions of the region 112 may be selected based,for example, on a desired amount of surface area for conducting heataway from the luminaire, as well as myriad other factors.

Region 112 is merely an exemplary embodiment and certainly heatsinkscontemplated herein are not intended to be limited to sizes and shapesthat fall within the particular size and shape of region 112. The actualdimensions of the heatsink selected for the installation can be anydimensions that fit within the geometric boundaries determined as setforth above. In some embodiments, the actual dimensions of the heatsinkmay be less than the maximum dimensions, while in other embodiments, theactual dimensions of the heatsink may be approximately equal to themaximum dimensions. The actual dimensions of the heatsink may bedetermined based on the desired level of conductivity of heat for eachheatsink, or other features or characteristics of the installation.Moreover, embodiments of the invention are directed to the heatsinksthemselves regardless of the methodology used to design the heatsinks.In other words, the methodology explained with respect to FIGS. 1A-1D isnot required to be used in the design of the heatsink embodimentsdisclosed herein.

FIG. 2 depicts a heatsink 200 that falls within the geometric dimensionsof the region 112 (shown in FIG. 1D), according to embodiments of thepresent disclosure. The heatsink 200 can include a base plate 202 fromwhich multiple fins, for example discrete pin fins 204 extend. In use,the heatsink 200 would be mounted to a luminaire via the base plate 202.The heatsink base plates contemplated herein are not limited to thespecific shapes illustrated herein. Rather, they may be of any shape(polygon, rectilinear, oval, round, etc.) within the geometricconstraints of the region 112 of FIG. 1D and suitable for attachment toa luminaire.

The pin fins 204 illustrated herein have a circular cross-sectionalshape. However, the pin fins 204 may have different shapes (e.g.,triangular, square, etc.) and/or be of different sizes. Nor must thesize and/or shape of all of the pins on a single heatsink be identical.For example, some pin fins 204 on a heatsink may have a triangularcross-section while others have a circular cross-section. Moreover, somepin fins 204 may have a larger diameter and/or cross-sectional area thanother pin fins 204. In some examples, continuous fins and pin fins 204may both be used.

The pin fins 204 may be provided on the base plate 202 of the heatsink200 in any orientation. In the illustrated embodiment, the pin fins 204are oriented on base plate 202 in aligned rows (e.g., rows 206, 208,210, 212) and columns (e.g., columns 214, 216, 218, 220). However, inother embodiments, the pin fins 204 may be provided in staggered columnsand/or rows, radially, or randomly on base plate 202.

In the non-limiting illustrated embodiment, the outer pin fins (e.g.,the pin fins proximate to a left side edge 222 or right side edge 224 ofthe base plate 202) of a particular row may have a shorter height thanthe pin fins 204 positioned more centrally within the row (i.e., moreproximate to the center of the base plate 202). For example, the heightof the pin fins 204 within a row may gradually increase moving from boththe left side edge 222 and right side edge 224 of the base plate 202inwardly toward the center of the row (or base plate 202). The pin fins204 of a row, for example the pin fins 204 of row 206, can each have aheight such that the tops of the pin fins 204 within the rowcollectively define a semi-spherical or arched shape from the left side222 to the right side 224 of the base plate 202.

Similarly, the height of the pin fins 204 within a column (e.g., columns214, 216, 218, 220) can also gradually increase from a front 226 of thebase plate 202 toward the rear 228 of the base plate. Regardless ofwhether aligned rows and/or columns are provided, the height of the pinfins 204 moving from opposing left side edge 222 and right side edge 224of the base plate 202 may gradually increase such that pin fins 204 morecentrally located on the heatsink 200 are taller than those locatedcloser to the side edges 222, 244. Similarly, the height of the pin fins204 moving from the front 226 of the base plate 202 to the rear 228 ofthe base plate 202 may also gradually increase such that the pin fins204 proximate to the rear 228 are taller than the pin fins 204 proximateto the front 226. For example, the maximum height of the pin fins 204 ofrow 206 can be less than the maximum height of the pin fins 204 of row210. In some aspects, the maximum height of the pin fins 204 of each rowcan increase from the front 226 of the base plate 202 to the rear 228 ofthe base plate.

While FIG. 2 shows pin fins 204, in some aspects, continuous fins may beused in addition to or in the place of the discrete pin fins. Thecontinuous fins may be shaped and provided in any suitable manner withinthe geometric constraints of the region 112 of FIG. 1D.

FIG. 3 depicts a heatsink 300, which falls within the geometricconstraints of the region 112 of FIG. 1D. Heatsink 300 includes multiplecontinuous fins 302 that extend from base plate 304. As shown in FIG. 3,the continuous fins 302 maintain the same general outline as the columnsof pin fins 204 of FIG. 2 (e.g., columns 214, 216, 218, 220) in that theheight of each continuous fin 302 increases from a front to a rear ofthe base plate 304. While FIG. 3 generally depicts continuous fins 302that maintain the same general outline as the columns of pin fins 204 ofFIG. 3, in some embodiments continuous fins may be provided such thatthey maintain the same general outline as the rows of pin fins 204 ofFIG. 2 (e.g., rows 206, 208, 210, 212).

FIG. 4 depicts a heatsink 400 which also falls within the geometricconstraints of the region 112 of FIG. 1D. The heatsink 400 is generallycone shaped and comprises a base plate 402. The heatsink 400 includes aseries of continuous fins 404 which extend vertically upwardly from thebase plate 402. The illustrated continuous fins 404 have a generallyarched shape such that the height of a continuous fin 404 graduallyincreases along the length of the continuous fin 404 until it reachespeak 406, after which the fin height gradually decreases. The peak 406of each continuous fin 404 can be, but does not have to be, near thecenter point of the continuous fin 404.

The continuous fins 404 can be positioned on base plate 402 such thatthe height of the peaks 406 increase from one side 408 of the base plate402 towards the center 410 of the base plate 402. The height of thepeaks 406 can then decrease from the center 410 of the base plate 402towards another side (not shown) of the base plate 402. In other words,the height of the peaks 406 of the continuous fins 404 graduallyincreases across the base plate 402 and toward the center 410 of thebase plate 402, after which the height of the peaks 406 graduallydecrease.

FIG. 5 depicts a heatsink 500 which also falls within the geometricconstraints of the region 112 of FIG. 1D. The heatsink 500 includes abase plate 502 and fins 504. The fins 504 may be positioned horizontallyrelative to base plate 502 (i.e., fins 504 and base plate 502 lie inparallel planes) and extend from a central fin 506. The central fin 506may extend vertically upwardly from the base plate 502 and may have agenerally triangular shape. Each of the fins 504 includes a firstportion 508 extending from a first side 510 of the central fin 506 and asecond portion 512 extending from a second side 514 of the central fin506 such that the first and second portions 508, 512 collectively definea width W of each fin 504. The width W of the fins 504 proximate to thebase plate 502 of the heatsink 500 may be greater than the width W ofthe fins 504 proximate to a top 516 of the central fin 506. One or moreof the fins 504 may be generally u-shaped, as shown in FIG. 5. The shapeand size of the fins 504 and the central fin 506 may be determined basedon the geometric constraints of the region 112 of FIG. 1D. Thus, thesize and shape of the fins 504 may be smaller near the top 516 of thecentral fin 506 than those fins 504 near the base plate 502, where thetop 516 of the central fin 506 corresponds to the upper portion 120 ofthe region 112, and the base plate 502 of the heatsink 500 correspondsto the lower portion 122 of the region 112 of FIG. 1D.

In some embodiments, heatsinks are provided with a combination of pinfins and continuous fins. Moreover, in some embodiments, the heatsinkmay be provided as a solid material devoid of pin fins or continuousfins, provided the heatsink falls within the geometric constraints ofthe region 112 of FIG. 1D.

FIG. 6 shows a first luminaire 600 (which includes a light engine 601onto which heatsink 602 is attached) and a second luminaire 604 (whichalso includes light engine 603 and heatsink 602), where the heatsinks602 are positioned at the desired center-to-center spacing C from eachother. The heatsinks 602 are generally sized and shaped as shown in thedepiction of the heatsink 200 of FIG. 2. Each of the heatsinks 602includes pin fins 606 extending from a base plate 608. As shown in FIG.6, the shape of the pin fins 606 and the base plate 608 of the heatsinks602 allow the luminaires 600, 604 to be rotated about an axis A (whichin this embodiment extends substantially perpendicular through theluminaires 600, 604) and tilted about an axis B (which in thisembodiment extends substantially perpendicular to axis A and about adesired pivot point) without the heatsinks 602 interfering with oneanother. The difference in the height of the pin fins 606 from a front607 of the base plate 608 towards a rear 609 of the base plate 698allows the luminaires 600, 604 to be tilted up to the maximum tilt angleT (see FIG. 1C) such that the light engines 601, 603 are tilted awayfrom one another while the respective heatsinks 602 are tilted towardsone another, without the heatsinks 602 contacting each other. Thus, theluminaires 600, 604 are able to tilt freely by ensuring their respectiveheatsinks 602 clear one another during tilting.

In some embodiments, the luminaires 600, 604 may rotate about axis A(potentially up to 360 degrees) even when the heatsinks 602 are orientedat the maximum desired tilt angle without the heatsinks 602 interferingwith one another because of the difference in height of the pin fins 606from an outer edge 610 of the base plate 608 toward a center of the baseplate 608. Thus, the height and position of the pin fins 606 of theheatsinks 602 allow the luminaires 600, 604 to tilt and rotate asdesired when positioned the desired center-to-center spacing C from eachother because the heatsinks 602 are designed to clear one anotherregardless of the position of the luminaires 600, 604 when so spaced.This is in contrast to typical heatsink designs that are not similarlydimensioned for clearance such that the luminaires on which they areprovided must be spaced further apart from each other to be able to tiltand rotate relative to each other. In some aspects, as shown in FIG. 7,additional luminaires, for example third luminaire 612 having a lightengine 605 and heatsink 602, can be positioned adjacent one anotherwithout the heatsinks 602 of the luminaires 600, 604, 612 contacting oneanother during the rotation and tilting of the luminaires 600, 604, 612.In some embodiments, multiple luminaires having heatsinks with geometricdimensions determined as shown in FIG. 1 can be positioned in otherarrangements relative to one another, for example to form a hexagon, ina two-by-two arrangement, in a three-by-three arrangement, or otherdesired arrangements.

A method 800 of determining the geometric dimensions of a heatsinkaccording to an embodiment of the present disclosure is shown in FIG. 8.At block 802 the desired center-to-center distance between adjacentheatsinks of a luminaire installation can be determined. Thecenter-to-center distance desired may depend on the location of theinstallation, the lighting angle desired, the size of the luminaires tobe installed, the number of luminaires in the installation, the positionof the luminaires relative to one another in the installation, and/orother features and characteristics of the installation.

At block 804, a 3-dimensional model cylinder having a diameter equal tothe center-to-center distance of the adjacent heatsinks of theinstallation is created. The model may be created using a computingdevice, for example the computing device of FIG. 9. The computing devicemay include a processing device that can execute one or more operationsfor performing the method described in FIG. 8. In some embodiments, aphysical model may be made.

At block 806, the 3-dimensional model cylinder can be positioned at theoriginal tilt angle of the heatsinks. For example, the heatsinks in theinstallation may be positioned at an original tilt angle that is about 0degrees off zenith. In some embodiments, the heatsinks may have astarting tilt angle that is more than 0 degrees off zenith, for example,but not limited to, 45 degrees.

At block 808 the 3-dimensional model cylinder is positioned at themaximum tilt angle desired for the heatsinks in the installation. Themodel cylinder is rotated about a desired pivot point. The desired pivotpoint can be determined based on the features and/or characteristics ofthe particular installation.

The maximum geometric dimensions of the heatsink can be determined atblock 810. The maximum geometric dimensions of the heatsink can bedetermined by calculating the geometric dimensions or boundaries ofwhere the 3-dimensional model cylinder at the original tilt angle andthe 3-dimensional model cylinder at in the maximum tilt angle overlapone another. The geometric dimensions defined by the regions where themodel cylinder at the original tilt angle and the model cylinder at themaximum tilt angle overlap correspond to the maximum geometricdimensions or boundaries of the heatsink that ensure a heatsink thatfits within such dimensions will not interfere with an adjacent heatsink(that also fits within such dimensions), positioned at the desiredcenter-to-center distance and at the desired tilt angle up to themaximum tilt angle.

FIG. 9 is a block diagram depicting an example of a computing device 900according to one aspect of the present disclosure. The computing device900 may include one or more of a processing device 902, a memory device904, and a bus 906. The processing device 902 can execute one or moreoperations for determining the geometric dimensions of a heatsink, forexample but not limited by performing the method 800 described above.The processing device 902 can execute instructions 908 stored in thememory device 904 to perform the operations. The processing device 902can include one processing device or multiple processing devices.Non-limiting examples of the processing device 902 include aField-Programmable Gate Array (“FPGA”), an application-specificintegrated circuit (“ASIC”), a microprocessor, etc.

The processing device 902 can be communicatively coupled to the memorydevice 904 via the bus 906. The memory device 904 may include any typeof memory device that retains stored information when powered off.Non-limiting examples of the memory device 904 include EEPROM, flashmemory, or any other type of non-volatile memory. In some aspects, atleast some of the memory device 904 can include a medium from which theprocessing device 902 can read the instructions 908. A computer-readablemedium can include electronic, optical, magnetic, or other storagedevices capable of providing the processing device 902 withcomputer-readable instructions or other program code. Non-limitingexamples of a computer-readable medium include (but are not limited to)magnetic disk(s), memory chip(s), ROM, RAM, an ASIC, a configuredprocessor, optical storage, or any other medium from which a computerprocessor can read instructions. The instructions may includeprocessor-specific instructions generated by a compiler or aninterpreter from code written in any suitable computer-programminglanguage, including, for example, C, C++, C#, etc.

Some embodiments of the present invention provide a heatsink thatcomprises pin fins provided on a base plate of the heatsink. The pinfins can be angled outwardly from a center of the base plate such thatthe tips of some of the fins extend beyond an outer edge of the baseplate. In some embodiments of the invention, the pin fins positionedcloser to the outer edge of the base plate can be shorter than the pinfins positioned closer to the center of the base plate. The shorterlength of the outer pin fins can permit cooler air to reach the pin finsproximate to the center of the base plate by reducing the number of pinfins the air has to pass through before reaching the center of the baseplate. The conduction of heat away from the center of the base plate ofthe heatsink can be improved by cooler air reaching the pin finsproximate to the center of the base plate.

FIG. 10 depicts a heatsink 1000 according to such an embodiment. Theheatsink 1000 includes a base plate 1002 and a plurality of pin fins1004 extending upwardly from, and at an angle relative to, the baseplate 1002 (and more specifically in some embodiments, the top surface1006 of the base plate 1002). As described above, the pin fins 1004 canbe of different shapes and/or sizes than as shown in FIG. 10.

While the pin fins 1004 can extend upwardly from the base plate 1002 atan approximate angle of 90 degrees relative to the base plate 1002, insome embodiments some or all of the pin fins 1004 are oriented at anangle less than 90 degrees. The desired angle of the pin fins 1004 canbe determined based on the desired characteristics of the installation.In some aspects, the air speed velocity through the pin fins 1004 can bemeasured as well as the temperature at various parts of the luminaire.In some aspects these measurements can be used to determine the desiredangle of the pin fins 1004. The pin fins 1004 need not all be orientedat the same angle. For example, FIGS. 11 and 12 shows pin fins 1004 morecentrally located on the base plate 1002 (such as within upper pin fintier 1014, discussed below) extending substantially at 90 degreesrelative to the base plate 1002 while the pin fins 1004 located closerto an outer edge 1008 of the base plate 1002 extend at a smaller anglerelative to the base plate 1002. By angling the pin fins 1004, some ofthe pin fins 1004 extend beyond the outer edge 1008 of the base plate1002. As shown in FIG. 10, the base plate 1002 of the heatsink 1000 canhave a diameter d that is less than the overall diameter D of theheatsink 1000.

In some aspects, the pin fins 1004 are provided in pin fin tiers, forexample a lower pin fin tier 1010, a middle pin fin tier 1012, and anupper pin fin tier 1014, though any number of pin fin tiers may beprovided. As shown in FIG. 10, the pin fins 1004 within the lower pinfin tier 1010 extend above the base plate 1002 less than the pin fins1004 within the middle pin fin tier 1012 or upper pin fin tier 1014.Similarly, the pin fins 1004 within the middle pin fin tier 1012 extendabove the base plate 1002 less than the pin fins 1004 within the upperpin fin tier 1014. In other words, the pin fins 1004 within the upperpin fin tier 1014 extend beyond the tips of the pin fins 1004 of thelower and middle pin fin tiers 1010, 1012 such that air coming in fromthe side of the heatsink 1000 may reach the pin fins 1004 within theupper pin fin tier 1014 directly without having first to pass throughthe pin fins 1004 that extend from the lower and middle pin fin tiers1010, 1012. Similarly, the pin fins 1004 within the middle pin fin tier1012 extend beyond the tips of the pin fins 1004 of the lower pin fintier 1010 such that air coming in from the side of the heatsink 1000 mayreach the pin fins 1004 within the middle pin fin tier 1012 directlywithout having first to pass through the pin fins 1004 that extend fromthe lower pin fin tier 1010. Moreover, the air need only pass throughthe pin fins 1004 of the middle pin fin tier 1012 before reachingportions of the pin fins 1004 of the upper pin fin tier 1014.

When the heatsink 1000 is attached to an LED light engine (such as viaattachment of the LED light engine to a lower surface 1016 of base plate1002), it is more difficult to dissipate the heat generated by the LEDslocated more centrally within the light engine and thus a hot spot formsat the center of light engine. It is therefore critical that air be ableto reach the center of the heatsink 1000 so as to carry the excessiveheat away via convection. The air heats and rises upwardly through theheatsink 1000, carrying away heat that otherwise would remain in thecentral portion of the heatsink 1000 where it would degrade the LEDs anddetrimentally impact their useful life. The heatsink design of FIGS.10-12 enhances the efficiency of the heatsink 1000 because it enablesair to reach the center of the heatsink 1000 more easily, bypassing someof the pin fins 1004 that would otherwise impede air flow to the centerof the heatsink 1000.

In some embodiments, the pin fins 1004 all extend directly from the baseplate 1002, and the desired pin fin height configuration (e.g., pin fintiers) is achieved by varying the height of the pin fins 1004. By wayonly of example, all of the pin fins 1004 may extend from the base plate1002 and be formed to create the various pin fin tiers 1010, 1012, 1014shown in FIG. 10. However, in other embodiments, the base plate 1002includes one or more raised tiers or surfaces from which the pin fins1004 may extend. For example, as shown in FIG. 11, two raised tiers1018, 1020 are each concentric circles formed or otherwise provided onthe base plate 1002. Pin fins 1004 of the lower pin fin tier 1010 extendfrom the top surface 1006 of the base plate 1002, pin fins 1004 of themiddle pin fin tier 1012 extend from raised tier 1018, and pin fins 1004of the upper pin fin tier 1014 extend from raised tier 1020. The raisedtiers 1018, 1020 may be of any size or shape and may be the same ordifferent shapes. In some aspects, the raised tiers 1018, 1020 could beoval, triangular, square, or other suitable shape or shapes. Any numberof raised tiers may be used. The raised tiers may be formed integrallywith base 1002 or could be separate components that are mounted on base1002 using any mechanical or chemical mounting means, including, but notlimited to, fasteners, adhesives, snap-fit engagement, etc.

While FIG. 10 illustrates a plurality of pin fin tier configuration,such a configuration is not required. Rather, a single tier of pin fins1004 may be provided. The single tier of pin fins 1004 may extend fromthe base plate 1002. The single tier of pin fins 1004 may extend to aconsistent height above the base plate 1002. The tips of the fin pins1004 that comprise the single tier of pin fins 1004 may define a top ofthe heatsink 1000.

Regardless of whether raised tiers 1018, 1020 are used, the heatsink1000 may be formed by initially forming the heatsink with the pin fins1004 at the desired height and at the desired angular orientationrelative to the base plate 1002. Alternatively, the pin fins 1004 mayinitially all be formed to extend perpendicular to the base plate 1002and subsequently and selectively angled outwardly to the desiredangle(s) to thereby open up the heatsink structure. Moreover, all of thepin fins 1004 can be formed of the same height and some or all of thepin fins 1004 subsequently cut to achieve the desired fin configuration.

In some embodiments, the ends of the pin fins 1004 (particularly the pinfins 1004 oriented at smaller angle(s) relative to the base plate 1002and located more proximate the outer edge 1008 of the base plate 1002)may be cut such that the pin fins 1004 do not extend beyond an overallor maximum diameter D of the heatsink 1000. The maximum diameter D ofthe heatsink 1000 can be selected based on the characteristics of thelighting installation in which the heatsink 1000 will be used. Forexample, if the heatsink 1000 is for use with a recessed luminaire suchthat it will be recessed within a ceiling, the maximum diameter D of theheatsink 1000 is defined so as not to exceed the diameter of the openingin the ceiling through which the heatsink 1000 must pass. The maximumdiameter D can also be impacted by the conduction requirements of theinstallation, the size of the installation, the size of the luminairesof the installation, and other features of the installation. As shown inFIG. 11, the base plate 1002 may have a cutout or an opening 1022 topermit wiring to pass through the heatsink 1000 and reach the lightengine (not shown) to which the heatsink 1000 (specifically lowersurface 1016) is attached.

The foregoing is provided for purposes of illustrating, explaining, anddescribing embodiments of the present invention. Further modificationsand adaptations to these embodiments will be apparent to those skilledin the art and may be made without departing from the scope or spirit ofthe invention. Different arrangements of the components depicted in thedrawings or described above as well as components and steps not shown ordescribed are possible. Similarly, some features and subcombinations areuseful and may be employed without reference to other features andsubcombinations. Embodiments of the invention have been described forillustrative and not restrictive purposes, and alternative embodimentswill become apparent to readers of this patent. Accordingly, the presentinvention is not limited to the embodiments described above or depictedin the drawings, and various embodiments and modifications can be madewithout departing from the scope of the claims below.

What is claimed is:
 1. A heatsink comprising: a base plate having afront, a rear, a left side, a right side, and a middle region; and aplurality of fins aligned in fin rows, each fin of the plurality of finshaving a height, and each fin row extending from the left side of thebase plate to the right side of the base plate; wherein a maximum finheight of the fin rows increases from the front of the base plate to therear of the base plate, and wherein the height of each fin of a fin rowincreases from the left side of the base plate to the middle region ofthe base plate and decreases from the middle region of the base plate tothe right side of the base plate.
 2. The heatsink of claim 1, wherein atleast some of the plurality of fins comprise pin fins.
 3. The heatsinkof claim 1, wherein at least some of the plurality of fins comprise acontinuous fin.
 4. The heatsink of claim 1, wherein the plurality offins are further aligned in fin columns extending from the front to theback of the base plate, wherein the height of the fin of each fin columnincreases from the front of the base plate to the rear of the baseplate.
 5. The heatsink of claim 4, wherein at least some of theplurality of fins comprise pin fins.
 6. The heatsink of claim 1, whereinthe plurality of fins comprise aluminum.
 7. The heatsink of claim 1,wherein the plurality of fins comprises copper.
 8. A heatsinkcomprising: a base plate having a front, a rear, a left side, a rightside, and a middle region; and a plurality of pin fins, each having aheight, provided in: fin rows extending from the left side of the baseplate to the right side of the base plate; and fin columns extendingfrom the front to the rear of the base plate, wherein the height of thepin fins within each fin column increases from the front of the baseplate to the rear of the base plate, and wherein the height of the pinfins within each fin row increases from the left side of the base plateto the middle region of the base plate and decreases from the middleregion of the base plate to the right side of the base plate.
 9. Theheatsink of claim 8, wherein the plurality of pin fins comprisealuminum.
 10. The heatsink of claim 8, wherein each fin row and each fincolumn comprises a maximum pin fin height, and wherein the maximum pinfin height of each fin row increases from the front of the base plate tothe rear of the base plate of the heatsink.
 11. The heatsink of claim 8,wherein the pin fins have one of an oval, a circular, or a triangularcross-section.
 12. A method for forming a first heatsink, the methodcomprising: determining a desired center-to-center distance between thefirst heatsink and a second heatsink; modeling a first cylinder with adiameter that corresponds to the desired center-to-center distance;defining a maximum tilt angle of the first heatsink; establishing apivot point of the first cylinder, the pivot point reflecting a pointabout which the first heatsink tilts; modeling a second cylinder on topof the first cylinder, wherein the second cylinder has a diameter thatis the same as the first cylinder; tilting the second cylinder about thepivot point to the maximum tilt angle; and determining an overlappingregion of the first cylinder and the second cylinder, wherein theoverlapping region corresponds to a geometric boundary of the firstheatsink.
 13. The method of claim 12, further comprising: forming thefirst heatsink, wherein the first heatsink comprises a size and a shapethat fall within the geometric boundary.
 14. The method of claim 13,wherein forming the first heatsink further comprises: providing a baseplate having a front, a rear, a left side, a right side, and a middleregion; and providing a plurality of fins aligned in fin rows, each finhaving a height and each fin row extending from the left side of thebase plate to the right side of the base plate, wherein a maximum finheight of the fin rows increases from the front of the base plate to therear of the base plate, and wherein the height of each fin of each finrow increases from the left side of the base plate to the middle regionof the base plate and decreases from the middle region of the base plateto the right side of the base plate.
 15. The method of claim 14, whereinat least some of the plurality of fins comprise pin fins.
 16. The methodof claim 14, wherein at least some of the plurality of fins comprise acontinuous fin.
 17. The method of claim 14, wherein providing aplurality of fins aligned in fin rows further comprises providing theplurality of fins aligned in fin columns, wherein the fin columns extendfrom the front to the back of the base plate, and wherein the height ofeach fin of each fin column increases from the front of the base plateto the rear of the base plate.
 18. The method of claim 13, whereinforming the first heatsink further comprises forming the first heatsinkfrom aluminum.
 19. The method of claim 13, wherein forming the firstheatsink, further comprises forming the first heatsink from copper. 20.The method of claim 18, wherein forming the first heatsink furthercomprises forming the first heatsink via impact forging.